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Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

✍ Scribed by Zong-jie HAN; Song-bai XUE; Jian-xin WANG; Xin ZHANG; Liang ZHANG; Sheng-lin YU; Hui WANG

Book ID
117693590
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
598 KB
Volume
18
Category
Article
ISSN
1003-6326

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