A HIGH-SPEED MICRO-IMPACT TESTING SYSTEM FOR EVALUATING THE PROPERTIES OF LEAD-FREE SOLDER JOINTS

✍ Scribed by D.-S. Liu; C.-Y. Kuo; C.-L. Hsu; C.-L. Chung

• Book ID: 111372045
• Publisher: John Wiley and Sons
• Year: 2009
• Tongue: English
• Weight: 949 KB
• Volume: 34
• Category: Article
• ISSN: 0732-8818
• DOI: 10.1111/j.1747-1567.2009.00480.x