✦ LIBER ✦

Lead-Free Electronic Solders || Deformation behavior of tin and some tin alloys

✍ Scribed by Yang, Fuqian

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Deformation behavior of tin and some tin

✍ Fuqian Yang; J. C. M. Li 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 361 KB

Deformation Mechanisms in Tin and Tin-Ba

✍ Mathew, M.D.; Movva, S.; Murty, K.Linga 📂 Article 📅 1999 🏛 Trans Tech Publications, Ltd. 🌐 English ⚖ 469 KB

Creep deformation characteristics of tin

✍ M. D. Mathew; H. Yang; S. Movva; K. L. Murty 📂 Article 📅 2005 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 427 KB

Creep resistance of tin-based lead-free

✍ M. L. Huang; C. M. L. Wu; L. Wang 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 187 KB

Determination of lead and tin in lead-ti

✍ B. Alfonsi 📂 Article 📅 1960 🏛 Elsevier Science 🌐 English ⚖ 355 KB

Spreading Dynamics of Tin, Bismuth and S

✍ Shang, Xiaogang; Mázur Lauricella, Christiane; Brandi, Sérgio Duarte 📂 Article 📅 2005 🏛 Trans Tech Publications, Ltd. 🌐 English ⚖ 249 KB