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Deformation Mechanisms in Tin and Tin-Based Electronic Solder Alloys

✍ Scribed by Mathew, M.D.; Movva, S.; Murty, K.Linga

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Creep deformation characteristics of tin

✍ M. D. Mathew; H. Yang; S. Movva; K. L. Murty 📂 Article 📅 2005 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 427 KB

Lead-Free Electronic Solders || Deformat

✍ Yang, Fuqian 📂 Article 📅 2007 🏛 Springer US ⚖ 253 KB

Determination of lead and tin in lead-ti

✍ B. Alfonsi 📂 Article 📅 1960 🏛 Elsevier Science 🌐 English ⚖ 355 KB

A microvolumetric determination of tin i

✍ Ch. Cimerman; M. Ariel 📂 Article 📅 1953 🏛 Elsevier Science 🌐 English ⚖ 935 KB

Table shows some of the results obtained by H~LTJE'S method.

Indentation creep in nanocrystalline Fe-

✍ Yoshikiyo Ogino; Tohru Yamasaki; Bao Long Shen 📂 Article 📅 1997 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 550 KB

Corrosion of joints in aluminum and its

✍ E. I. Storchai; L. N. El'chinova; A. V. Sokolova; M. V. Kuznetsova 📂 Article 📅 1973 🏛 Springer 🌐 English ⚖ 223 KB