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SPIE Proceedings [SPIE MOEMS-MEMS 2008 Micro and Nanofabrication - San Jose, CA (Saturday 19 January 2008)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII - A new model for vacuum quality and lifetime prediction in hermetic vacuum bonded MEMS

✍ Scribed by Bonucci, A.; Guadagnuolo, S.; Caterino, A.; Conte, A.; Moraja, M.; Hartzell, Allyson L.; Ramesham, Rajeshuni

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