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SPIE Proceedings [SPIE MOEMS-MEMS 2006 Micro and Nanofabrication - San Jose, CA (Saturday 21 January 2006)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V - A new technique for 3D profilometry of MEMS

✍ Scribed by Lyuboshenko, Igor; Bosseboeuf, Alain; Tanner, Danelle M.; Ramesham, Rajeshuni

No coin nor oath required. For personal study only.

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