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SPIE Proceedings [SPIE Micromachining and Microfabrication - San Jose, CA (Saturday 24 January 2004)] Reliability, Testing, and Characterization of MEMS/MOEMS III - Reliable bonding using indium-based solders

✍ Scribed by Cheong, Jongpil; Goyal, Abhijat; Tadigadapa, Srinivas; Rahn, Christopher; Tanner, Danelle M.; Ramesham, Rajeshuni

Book ID: 121506615
Publisher: SPIE
Year: 2004
Weight: 274 KB
Volume: 5343
Category: Article
DOI: 10.1117/12.524823

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