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Selective vapor phase etching of SiGe by HCl in a RPCVD reactor

✍ Scribed by Yuji Yamamoto; Klaus Köpke; Rainer Kurps; Bernd Tillack


Book ID
104002367
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
378 KB
Volume
254
Category
Article
ISSN
0169-4332

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✦ Synopsis


Fig. 5. Optical microscope image of the sample with line and space after HCl etching at 650 8C for 960 s. [1 1 0] and [1 0 0] direction are written with arrows in (a) and (b), respectively. Positions of initial sidewall and etchfront of SiGe with 30% Ge content are also indicated with arrows.


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