## Abstract Selective area growth (SAG) based on plasma assisted molecular beam epitaxy (PAMBE) was demonstrated to be effective to achieve low contact resistance for nonalloyed ohmic metals. An AlGaN/GaN high‐electron mobility transistor (HEMT) using SAG by PAMBE with nonalloyed ohmic metals and r
Selective-area growth and fabrication of recessed-gate GaN MESFET using plasma-assisted molecular beam epitaxy
✍ Scribed by Hong, Seung Jae ;Chapman, Patrick ;Krein, Philip T. ;Kim, Kyekyoon (Kevin)
- Publisher
- John Wiley and Sons
- Year
- 2006
- Tongue
- English
- Weight
- 172 KB
- Volume
- 203
- Category
- Article
- ISSN
- 0031-8965
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✦ Synopsis
Abstract
For the first time, selective‐area growth (SAG) technique has been developed using plasma‐assisted molecular beam epitaxy (PAMBE), enabling fabrication of a recessed‐gate structure for the metal‐semiconductor field‐effect transistor (MESFET) without etching. On patterned SiO~2~ samples, polycrystalline GaN and single crystal n^+^‐GaN were observed to grow in the masked and unmasked regions, respectively. The regrown layers were analyzed using AFM. Ohmic contact formed on the n^+^‐GaN exhibited a vastly improved contact resistivity of 1.8 × 10^–8^ Ω cm^2^, giving rise to excellent device characteristics including a peak drain current of 360 mA/mm and a maximum transconductance of 46 mS/mm. The advantages of SAG were further investigated by comparing the dc characteristics of recessed‐gate and unrecessed MESFET. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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InGaN/GaN multiple quantum-wells (MQWs) on Ga-polarity GaN by plasma-assisted molecularbeam epitaxy were grown and characterized. In-situ reflection high-energy-electron diffraction observations and high-resolution X-ray diffraction results indicated that a flat interface and a good periodicity of t