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Selective-area growth and fabrication of recessed-gate GaN MESFET using plasma-assisted molecular beam epitaxy

✍ Scribed by Hong, Seung Jae ;Chapman, Patrick ;Krein, Philip T. ;Kim, Kyekyoon (Kevin)


Publisher
John Wiley and Sons
Year
2006
Tongue
English
Weight
172 KB
Volume
203
Category
Article
ISSN
0031-8965

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✦ Synopsis


Abstract

For the first time, selective‐area growth (SAG) technique has been developed using plasma‐assisted molecular beam epitaxy (PAMBE), enabling fabrication of a recessed‐gate structure for the metal‐semiconductor field‐effect transistor (MESFET) without etching. On patterned SiO~2~ samples, polycrystalline GaN and single crystal n^+^‐GaN were observed to grow in the masked and unmasked regions, respectively. The regrown layers were analyzed using AFM. Ohmic contact formed on the n^+^‐GaN exhibited a vastly improved contact resistivity of 1.8 × 10^–8^ Ω cm^2^, giving rise to excellent device characteristics including a peak drain current of 360 mA/mm and a maximum transconductance of 46 mS/mm. The advantages of SAG were further investigated by comparing the dc characteristics of recessed‐gate and unrecessed MESFET. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)


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