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Reliability behavior of lead-free solder joints in electronic components

โœ Scribed by Liang Zhang, Ji-guang Han, Cheng-wen He, Yong-huan Guo

Book ID
118801612
Publisher
Springer US
Year
2012
Tongue
English
Weight
848 KB
Volume
24
Category
Article
ISSN
0957-4522

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Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al