✦ LIBER ✦

Reliability testing of WLCSP lead-free solder joints

✍ Scribed by Huann-Wu Chiang; Jun-Yuan Chen; Ming-Chuan Chen; Jeffrey C. B. Lee; Gary Shiau

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Reliability of Sn–Ag–Sb lead-free solder

✍ Hwa-Teng Lee; Heng-Sheng Lin; Cheng-Shyan Lee; Po-Wei Chen 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 768 KB

Lead-free soldering: Materials science a

✍ Kejun Zeng 📂 Article 📅 2009 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 193 KB

Reliability behavior of lead-free solder

✍ Liang Zhang, Ji-guang Han, Cheng-wen He, Yong-huan Guo 📂 Article 📅 2012 🏛 Springer US 🌐 English ⚖ 848 KB

A study on μBGA solder joints reliabilit

✍ Shin, Young-Eui ;Lee, Jun Hwan ;Koh, Young-Wook ;Lee, Chong-Won ;Yun, Jun Ho ;Ju 📂 Article 📅 2002 🏛 Springer-Verlag 🌐 Korean ⚖ 850 KB

Electromigration issues in lead-free sol

✍ Chih Chen; S. W. Liang 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 412 KB

The creep properties of lead-free solder

✍ H. G Song; J. W. Morris; F. Hua 📂 Article 📅 2002 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 372 KB