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A study on μBGA solder joints reliability using lead-free solder materials

✍ Scribed by Shin, Young-Eui ;Lee, Jun Hwan ;Koh, Young-Wook ;Lee, Chong-Won ;Yun, Jun Ho ;Jung, Seung-Boo

Publisher
Springer-Verlag
Year
2002
Tongue
Korean
Weight
850 KB
Volume
16
Category
Article
ISSN
1226-4865

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