✦ LIBER ✦
Solder Joint Reliability Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead-Free Solder Materials and Solder Mask Dimensions
✍ Scribed by Y. S. Chen; C. S. Wang; T. C. Wang; W. H. Chan; K. C. Chang; T. D. Yuan
- Book ID
- 107453542
- Publisher
- Springer US
- Year
- 2006
- Tongue
- English
- Weight
- 1022 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0361-5235
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