Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

✍ Scribed by Yanghua Xia; Xiaoming Xie

• Book ID: 116601835
• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 919 KB
• Volume: 454
• Category: Article
• ISSN: 0925-8388
• DOI: 10.1016/j.jallcom.2006.12.098