Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag

✍ Scribed by Zhou, Ping ;Hu, Bing-ting ;Zhou, Jie-min ;Yang, Ying

• Publisher: Chinese Electronic Periodical Services
• Year: 2009
• Tongue: English
• Weight: 423 KB
• Volume: 16
• Category: Article
• ISSN: 1005-9784
• DOI: 10.1007/s11771-009-0057-8