Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints

✍ Scribed by Yoshiharu Kariya; Yasunori Hirata; Masahisa Otsuka

• Publisher: Springer US
• Year: 1999
• Tongue: English
• Weight: 473 KB
• Volume: 28
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-999-0166-z