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Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps

✍ Scribed by Wu, G.; Xu, D.; Xiong, B.; Wang, Y.

Book ID: 119799753
Publisher: IEEE
Year: 2012
Tongue: English
Weight: 337 KB
Volume: 33
Category: Article
ISSN: 0741-3106
DOI: 10.1109/led.2012.2200231

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