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Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging

✍ Scribed by Rong Zhang; Lo, J.C.C.; Lee, S.W.R.

Book ID: 119816146
Publisher: IEEE
Year: 2012
Tongue: English
Weight: 462 KB
Volume: 12
Category: Article
ISSN: 1530-4388
DOI: 10.1109/tdmr.2012.2190764

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