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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer

✍ Scribed by Yoon, Kihyun; Kim, Gawon; Lee, Woojin; Song, Taigon; Lee, Junho; Lee, Hyungdong; Park, Kunwoo; Kim, Joungho

No coin nor oath required. For personal study only.

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