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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Improving reliability of lateral thermosonic flip-chip bonding with ACF

✍ Scribed by Ha, Chang-Wan; Kim, Kyung-Soo

Book ID: 120710238
Publisher: IEEE
Year: 2009
Weight: 499 KB
Category: Article
ISBN: 1424450993
DOI: 10.1109/EPTC.2009.5416577

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