𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Direct liquid thermal management of 3D chip stacks

✍ Scribed by Bar-Cohen, A.; Geisler, K. J. L.; Rahim, E.

Book ID: 115525591
Publisher: IEEE
Year: 2009
Weight: 780 KB
Volume: 0
Category: Article
ISBN: 1424450993
DOI: 10.1109/eptc.2009.5416562

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2009 11th Electronics Packaging Te

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Polymer optical waveguide fabrication using laser ablation

✍ Zakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Selviah, David R.; Wang, 📂 Article 📅 2009 🏛 IEEE ⚖ 740 KB

[IEEE 4th Electronics Packaging Technolo

[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - Direct liquid cooling of a stacked multichip module

✍ Chen, X.Y.; Toh, K.C.; Chai, J.C.; Pinjala, D. 📂 Article 📅 2002 🏛 IEEE ⚖ 485 KB

[IEEE 2009 IEEE International Conference

[IEEE 2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems - COMCAS - Tel Aviv, Israel (2009.11.9-2009.11.11)] 2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems - Thermal management of on-chip hot spots and 3D chip stacks

✍ Bar-Cohen, Avram 📂 Article 📅 2009 🏛 IEEE ⚖ 492 KB

[IEEE 2011 IEEE 13th Electronics Packagi

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Study of interaction between Cu-SnAg and Ni-SnAg interfacial reactions by low solder volume in 3D IC packaging

✍ Hsiang-Yao Hsiao, ; Yi-Sa Huang, ; Chih Chen, 📂 Article 📅 2011 🏛 IEEE ⚖ 928 KB