[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Study of interaction between Cu-SnAg and Ni-SnAg interfacial reactions by low solder volume in 3D IC packaging

✍ Scribed by Hsiang-Yao Hsiao, ; Yi-Sa Huang, ; Chih Chen,

• Book ID: 111950792
• Publisher: IEEE
• Year: 2011
• Weight: 928 KB
• Volume: 0
• Category: Article
• ISBN: 1457719819
• DOI: 10.1109/eptc.2011.6184467