[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Electroless Ni-W-P alloy as a more enduring and reliable soldering metallization

✍ Scribed by Yang, Y.; Balaraju, J. N.; Tsakadze, Z.; Chen, Z.

• Book ID: 118044050
• Publisher: IEEE
• Year: 2011
• Weight: 1004 KB
• Volume: 0
• Category: Article
• ISBN: 1457719819
• DOI: 10.1109/eptc.2011.6184383