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[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - Direct liquid cooling of a stacked multichip module

✍ Scribed by Chen, X.Y.; Toh, K.C.; Chai, J.C.; Pinjala, D.

Book ID: 115525590
Publisher: IEEE
Year: 2002
Weight: 485 KB
Volume: 0
Category: Article
ISBN-13: 9780780374355
DOI: 10.1109/eptc.2002.1185702

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