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[IEEE 2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems - COMCAS - Tel Aviv, Israel (2009.11.9-2009.11.11)] 2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems - Thermal management of on-chip hot spots and 3D chip stacks

✍ Scribed by Bar-Cohen, Avram

Book ID: 115525571
Publisher: IEEE
Year: 2009
Weight: 492 KB
Volume: 0
Category: Article
ISBN: 142443985X
DOI: 10.1109/comcas.2009.5385939

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