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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Effect of postcure and thermal aging on molding compound properties

✍ Scribed by de Vreugd, J.; Monforte, A. Sanchez; Jansen, K.M.B.; Ernst, L.J.; Bohm, C.; Kessler, A.; Preu, H.

Book ID: 120996256
Publisher: IEEE
Year: 2009
Weight: 711 KB
Category: Article
ISBN: 1424450993
DOI: 10.1109/EPTC.2009.5416524

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