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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - High frequency characterization of through silicon via structure

✍ Scribed by Mong, Khoo Yee; Kee, Chua Eng; Guan, Lim Teck; Enxiao, Liu

Book ID: 124155915
Publisher: IEEE
Year: 2009
Weight: 424 KB
Category: Article
ISBN: 1424450993
DOI: 10.1109/EPTC.2009.5416491

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