Characterisation of silicon through-vias for wafer-level interconnection with glass reflows

✍ Scribed by Jin, J.Y.; Yoo, S.; Yoo, B.W.; Kim, Y.K.

• Book ID: 118033902
• Publisher: The Institution of Electrical Engineers
• Year: 2012
• Tongue: English
• Weight: 450 KB
• Volume: 48
• Category: Article
• ISSN: 0013-5194
• DOI: 10.1049/el.2012.2821