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3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections

✍ Scribed by Khan, Navas; Yu, Li Hong; Pin, Tan Siow; Ho, Soon Wee; Kripesh, Vaidyanathan; Pinjala, Damaruganath; Lau, John H.; Chuan, Toh Kok

Book ID
119965075
Publisher
Institute of Electrical and Electronics Engineers
Year
2013
Tongue
English
Weight
987 KB
Volume
3
Category
Article
ISSN
2156-3950

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