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Development of 3-D Silicon Module With TSV for System in Packaging

✍ Scribed by Khan, N.; Rao, V.S.; Lim, S.; Ho Soon We, ; Lee, V.; Xiaowu Zhang, ; Liao, E.B.; Nagarajan, R.; Chai, T.C.; Kripesh, V.; Lau, J.H.

Book ID: 120517427
Publisher: IEEE
Year: 2010
Tongue: English
Weight: 1008 KB
Volume: 33
Category: Article
ISSN: 1521-3331
DOI: 10.1109/TCAPT.2009.2037608

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