✦ LIBER ✦

Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies

✍ Scribed by Khan, N.H.; Alam, S.M.; Hassoun, S.

Book ID: 118010468
Publisher: IEEE
Year: 2011
Tongue: English
Weight: 910 KB
Volume: 19
Category: Article
ISSN: 1063-8210
DOI: 10.1109/tvlsi.2009.2038165

No coin nor oath required. For personal study only.

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