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Fast Scan-Chain Ordering for 3-D-IC Designs Under Through-Silicon-Via (TSV) Constraints

✍ Scribed by Liao, Christina C.-H.; Chen, Allen W.-T.; Lin, Louis Y.-Z.; Wen, Charles H.-P.

Book ID: 120348750
Publisher: IEEE
Year: 2013
Tongue: English
Weight: 341 KB
Volume: 21
Category: Article
ISSN: 1063-8210
DOI: 10.1109/TVLSI.2012.2204781

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