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Recent advances in modeling the underfill process in flip-chip packaging

✍ Scribed by J.W. Wan; W.J. Zhang; D.J. Bergstrom

Publisher: Elsevier Science
Year: 2007
Tongue: English
Weight: 190 KB
Volume: 38
Category: Article
ISSN: 0026-2692
DOI: 10.1016/j.mejo.2006.09.017

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