✦ LIBER ✦
Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device
✍ Scribed by Yasuyuki Morita; Kazuo Arakawa; Mitsugu Todo; Masayuki Kaneto
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 537 KB
- Volume
- 46
- Category
- Article
- ISSN
- 0026-2714
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