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Anisotropic behavior of the capillary action in flip chip underfill

โœ Scribed by Wen-Bin Young


Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
428 KB
Volume
34
Category
Article
ISSN
0026-2692

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Numerical simulation of conventional cap
โœ Tomohisa Hashimoto; Tanifuji Shin-ichiro; Koji Morinishi; Nobuyuki Satofuka ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 398 KB

We developed a numerical method for simulating the underfill flow of conventional capillary flow and no-flow types in flip-chip packaging. The analytical models for the two types of underfill encapsulation processes are proposed. In the capillary flow type, the underfill material is driven into the