Numerical simulation of conventional cap
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Tomohisa Hashimoto; Tanifuji Shin-ichiro; Koji Morinishi; Nobuyuki Satofuka
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Article
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2008
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Elsevier Science
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English
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We developed a numerical method for simulating the underfill flow of conventional capillary flow and no-flow types in flip-chip packaging. The analytical models for the two types of underfill encapsulation processes are proposed. In the capillary flow type, the underfill material is driven into the