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Preparation of high-aspect ratio periodic corrugations by plasma and ion etching

✍ Scribed by Somekh, S. ;Casey, H. C. ;Ilegems, M.

Book ID
115325262
Publisher
The Optical Society
Year
1976
Tongue
English
Weight
455 KB
Volume
15
Category
Article
ISSN
1559-128X

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Different processes involving an inductively coupled plasma reactor are presented either for deep reactive ion etching or for isotropic etching of silicon. On one hand, high aspect ratio microstructures with aspect ratio up to 107 were obtained on sub-micron trenches. Application to photonic MEMS is