๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Predicting visual fatigue in integrated circuit packaging plants

โœ Scribed by Jhih-Tsong Lin; Guo-Feng Liang; Sheue-Ling Hwang; Eric Min-yang Wang


Publisher
John Wiley and Sons
Year
2010
Tongue
English
Weight
157 KB
Volume
20
Category
Article
ISSN
1090-8471

No coin nor oath required. For personal study only.

โœฆ Synopsis


Abstract

In the reworking department of integrated circuit (IC) production, both inspection and repair are visual tasks, and reworking operators frequently complain about eyestrain problems that lead to human error and a low yield rate. In this study, we evaluate the relationship between the operators' visual fatigue and actual defect data gathered from May to June 2008 and find a positive relationship between visual fatigue and the number of defects. To prevent eyestrain overload, we develop a visual fatigue prediction model using as significant predictors working time, rest time, number of inspections, number of repairs, and task difficulty. After the model was implemented in a real workplace, both visual comfort and yield rate improved. ยฉ 2010 Wiley Periodicals, Inc.


๐Ÿ“œ SIMILAR VOLUMES


A new chemorheological analysis of highl
โœ Peter J. Halley ๐Ÿ“‚ Article ๐Ÿ“… 1997 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 331 KB

Chemorheology (and thus process modeling) of highly filled thermosets used in integrated circuit (IC) packaging has been complicated by their highly filled nature, fast kinetics of curing, and viscoelastic nature. This article summarizes a more thorough chemorheological analysis of a typical IC pack