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Non-destructive identification of defects in integrated circuit packages by scanning acoustic microscopy

✍ Scribed by Jicheng Yang

Publisher: Elsevier Science
Year: 1996
Tongue: English
Weight: 413 KB
Volume: 36
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(95)00042-9

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