✦ LIBER ✦

A new chemorheological analysis of highly filled thermosets used in integrated circuit packaging

✍ Scribed by Peter J. Halley

Publisher: John Wiley and Sons
Year: 1997
Tongue: English
Weight: 331 KB
Volume: 64
Category: Article
ISSN: 0021-8995
DOI: 10.1002/(sici)1097-4628(19970404)64:1<95::aid-app8>3.0.co;2-m

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✦ Synopsis

Chemorheology (and thus process modeling) of highly filled thermosets used in integrated circuit (IC) packaging has been complicated by their highly filled nature, fast kinetics of curing, and viscoelastic nature. This article summarizes a more thorough chemorheological analysis of a typical IC packaging thermoset material, including novel isothermal and nonisothermal multiwave parallel-plate chemorheology. This new chemorheological analysis may be used to optimize existing and design new IC packaging processes.

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