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Methods of analysing thermomechanical stress in plastic packages for integrated circuits

✍ Scribed by O. Slattery; T. Hayes; W. Lawton; G. Kelly; C. Lyden; J. Barrett; C. O'Mathuna

Publisher: Elsevier Science
Year: 1995
Tongue: English
Weight: 622 KB
Volume: 54
Category: Article
ISSN: 0924-0136
DOI: 10.1016/0924-0136(95)01942-1

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