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Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating

✍ Scribed by Park, Jae-Hyung; Moon, Dae-Yong; Han, Dong-Suk; Kang, Yu-Jin; Shin, So-Ra; Jeon, Hyung-Tag; Park, Jong-Wan

No coin nor oath required. For personal study only.

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