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Ohmic contacts on diamond by B ion implantation and Ti-Au metallization

✍ Scribed by Venkatesan, V.; Das, K.


Book ID
125537534
Publisher
IEEE
Year
1992
Tongue
English
Weight
312 KB
Volume
13
Category
Article
ISSN
0741-3106

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Ohmic contacts and interface properties
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The Au/Ti/p-diamond contacts were prepared by r.f. sputtering and I-V measurements showed that the as-deposited contacts were ohmic. Upon annealing at 500 Β°C for 10 min in a vacuum of 10 -4 Pa, the ohmic characteristics of the contacts were improved by 30%. The specific contact resistivity, which wa