✦ LIBER ✦

Numerical modeling and experimental verification of through silicon via (TSV) filling in presence of additives

✍ Scribed by Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Chen, Jing; Miao, Min; Jin, Yufeng

Book ID: 121483373
Publisher: Elsevier Science
Year: 2014
Tongue: English
Weight: 973 KB
Volume: 117
Category: Article
ISSN: 0167-9317
DOI: 10.1016/j.mee.2013.12.002

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Numerical modeling and experimental veri

Numerical modeling and experimental verification of mold filling and evolved gas pressure in lost foam casting process

✍ Y. Liu; S. I. Bakhtiyarov; R. A. Overfelt 📂 Article 📅 2002 🏛 Springer 🌐 English ⚖ 285 KB

3D-interconnect: Visualization of extrus

3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy

✍ LayWai Kong; Andrew C. Rudack; Peter Krueger; Ehrenfried Zschech; Sitaram Arkalg 📂 Article 📅 2012 🏛 Elsevier Science 🌐 English ⚖ 689 KB

Electrical Modeling and Design for 3D Sy

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Modeling of Through-Silicon Vias (TSV) in 3D Integration

✍ Li, Er-Ping 📂 Article 📅 2012 🏛 John Wiley & Sons, Inc. 🌐 English ⚖ 326 KB

**New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems** Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity a

[IEEE 2011 6th International Microsystem

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Study on copper plating solutions for fast filling of through silicon via (TSV) in 3D electronic packaging

✍ Wu, H. L. Henry; Lee, S. W. Ricky 📂 Article 📅 2011 🏛 IEEE ⚖ 667 KB

[IEEE 2009 IEEE International Electron D

[IEEE 2009 IEEE International Electron Devices Meeting (IEDM) - Baltimore, MD, USA (2009.12.7-2009.12.9)] 2009 IEEE International Electron Devices Meeting (IEDM) - Compact AC modeling and analysis of Cu, W, and CNT based through-silicon vias (TSVs) in 3-D ICs

✍ Chuan Xu, ; Hong Li, ; Suaya, Roberto; Banerjee, Kaustav 📂 Article 📅 2009 🏛 IEEE 🌐 English ⚖ 409 KB

[IEEE 2012 IEEE 11th International Confe

[IEEE 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Xian, China (2012.10.29-2012.11.1)] 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology - Understanding effect of additives in copper electroplating filling for through silicon via

✍ Miao, Min; Zhu, Yunhui; Bian, Yuan; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, 📂 Article 📅 2012 🏛 IEEE ⚖ 342 KB