✦ LIBER ✦

[IEEE 2009 IEEE International Electron Devices Meeting (IEDM) - Baltimore, MD, USA (2009.12.7-2009.12.9)] 2009 IEEE International Electron Devices Meeting (IEDM) - Compact AC modeling and analysis of Cu, W, and CNT based through-silicon vias (TSVs) in 3-D ICs

✍ Scribed by Chuan Xu, ; Hong Li, ; Suaya, Roberto; Banerjee, Kaustav

No coin nor oath required. For personal study only.

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