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[IEEE 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Xian, China (2012.10.29-2012.11.1)] 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology - Understanding effect of additives in copper electroplating filling for through silicon via

✍ Scribed by Miao, Min; Zhu, Yunhui; Bian, Yuan; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Fang, Runiu; Chen, Jing; Jin, Yufeng

Book ID: 120810799
Publisher: IEEE
Year: 2012
Weight: 342 KB
Category: Article
ISBN: 1467324736
DOI: 10.1109/ICSICT.2012.6467713

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