✦ LIBER ✦
3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy
✍ Scribed by LayWai Kong; Andrew C. Rudack; Peter Krueger; Ehrenfried Zschech; Sitaram Arkalgud; A.C. Diebold
- Book ID
- 113797779
- Publisher
- Elsevier Science
- Year
- 2012
- Tongue
- English
- Weight
- 689 KB
- Volume
- 92
- Category
- Article
- ISSN
- 0167-9317
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