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Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys

✍ Scribed by Kazuhiro Nogita; Tetsuro Nishimura


Book ID
113897279
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
848 KB
Volume
59
Category
Article
ISSN
1359-6462

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