Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu, Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate

✍ Scribed by Narayan, S; Prabhu, K N

• Book ID: 126250820
• Publisher: Institute of Materials, Minerals and Mining
• Year: 2013
• Tongue: English
• Weight: 723 KB
• Volume: 29
• Category: Article
• ISSN: 0267-0836
• DOI: 10.1179/1743284712Y.0000000162