Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate

✍ Scribed by Lu, Bin ;Li, Hui ;Wang, Juan-hui ;Zhu, Hua-wei ;Jiao, Xian-he

• Publisher: Chinese Electronic Periodical Services
• Year: 2008
• Tongue: English
• Weight: 933 KB
• Volume: 15
• Category: Article
• ISSN: 1005-9784
• DOI: 10.1007/s11771-008-0059-y