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Characterization of Co–Sn intermetallic compounds in Sn–3.0Ag–0.5Cu–0.5Co lead-free solder alloy

✍ Scribed by Feng Gao; Fangjie Cheng; Hiroshi Nishikawa; Tadashi Takemoto

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Constitutive Behavior of Mixed Sn-Pb/Sn-

✍ J.P. Tucker; D.K. Chan; G. Subbarayan; C.A. Handwerker 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 893 KB

Characterization of Cu3P phase in Sn3.0A

✍ Chen, Jian-xun; Zhao, Xing-ke; Zou, Xu-chen; Huang, Ji-hua; Hu, Hai-chun; Luo, H 📂 Article 📅 2014 🏛 Springer-Verlag 🌐 English ⚖ 673 KB

Nanoparticles of the Lead-free Solder Al

✍ Chang Dong Zou; Yu Lai Gao; Bin Yang; Xin Zhi Xia; Qi Jie Zhai; Cristina Anderss 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 279 KB

Corrosion Behavior of Sn-3.0Ag-0.5Cu Lea

✍ Mui Chee Liew, Ibrahym Ahmad, Liu Mei Lee… 📂 Article 📅 2012 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 795 KB

Comparison of spreading behaviour and in

✍ Narayan, S; Prabhu, K N 📂 Article 📅 2013 🏛 Institute of Materials, Minerals and Mining 🌐 English ⚖ 723 KB

Intermetallic formation in Sn3Ag0.5Cu an

✍ Tung-Han Chuang; Shiu-Fang Yen; Hui-Min Wu 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 765 KB